Simultaneous Improvement of Formaldehyde Emission and Adhesion of Medium-Density Fiberboard Bonded with Low-Molar Ratio Urea-Formaldehyde Resins Modified with Nanoclay

In wood-based composite panels, low-molar ratio (LMR) urea-formaldehyde (UF) resins usually result in reduced formaldehyde emission (FE) at the expense of poor adhesion. However, FE and adhesion medium-density fiberboard (MDF) bonded with LMR UF were both improved this study. The modified transition metal ion-modified bentonite (TMI-BNT) nanoclay simultaneously MDF panels. 5% TMI-BNT resulted a 37.1% reduction 102.6% increase internal bonding (IB) strength Furthermore, thickness swelling water absorption also significantly decreased to 13.0% 24.9%, respectively. These results imply that modification could enhance formation three-dimensional network rather than crystalline domains, resulting cohesion.